Category :
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Product Status :
Obsolete
Peripherals :
DMA, POR, WDT
Primary Attributes :
FPGA - 350K Logic Elements
Supplier Device Package :
896-FBGA, FC (31x31)
Connectivity :
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
896-BBGA, FCBGA
Number of I/O :
MCU - 208, FPGA - 250
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Description :
IC FPGA ARRIA V SX FLIP CHIP
Shipping Method :
LCL, AIR, FCL, Express
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram